Dear Hiring Manager,

As an IC Packaging Engineer with 2 years of post-graduate experience in semiconductor design and manufacturing settings, I apply with great interest for this opportunity.

I am currently a Junior IC Packaging Engineer at Halliwell Technologies, where I work cross-functionally to produce IC packaging designs from concept to tape out. This entails defining and developing design flow rules, implementing in-house packaging layout, optimizing package design on signal/power integrity, and coordinating with the Design team on package model extraction and analysis.

In addition to my experience, I hold a Master of Circuit Design and a Bachelor of Software Engineering. Per your requirements, I have strong knowledge of Cadence APD, SiP, high-speed IO interfaces (DDR, PCIE, Ethernet), MATLAB, and Python.

For me, this isn’t a job - it’s a passion. I now seek an opportunity to take my creativity and drive to the next level with a company whose products I truly admire.

Please find attached my résumé for your consideration. Thank you very much for your time. I look forward to hearing from you regarding next steps.

Yours sincerely,

Jeffrey Chang